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NVIDIA Spectrum X Ethernet with co-packaged optics uses indium phosphide laser dies and TSMC CoOP process, creating supply chain dependency for 200Gbps switching
Jensen Huang· NVIDIA· AI· 2026-06-02· about TSMC (TSM)
“NVIDIA Spectrum X Ethernet Photonics, the world's first Ethernet switch with 200 gigabit co-packaged optics, TSMC's COOP process, chip scale packaging and ultra high-powered laser dyes on indium phosphide”
Why it matters
Spectrum X's co-packaged optics design is a critical component of Vera Rubin's multi-rack interconnect. This requires indium phosphide laser technology and TSMC's emerging CoOP process, which is capacity-constrained.
Investment implication
Indium phosphide suppliers and TSMC's CoOP process capacity will become bottlenecks for high-speed AI networking infrastructure. Companies dependent on indium phosphide (like laser die suppliers) will see sustained demand.