infrastructureScore 85/100Research
NVIDIA secures first Blackwell wafers on U.S. soil via TSMC; expanding domestic supply chain with Foxconn, Wistron, Amcor.
“Last month, in partnership with TSMC, we celebrated the first Blackwell wafer produced on US soil. We'll continue to work with Fox conn, Vistron, Amcor, Spill, and others to grow our presence in The US over the next four years.”
Why it matters
NVIDIA is actively reshoring Blackwell production and establishing U.S. manufacturing partnerships to reduce geopolitical risk and Taiwan dependency. This signals a multi-year capex commitment to domestic supply chain resilience.
Investment implication
TSMC's U.S. fab capacity (Arizona Fab 21/22) will see accelerated utilization and potential capex expansion. U.S.-based packaging and assembly partners (Foxconn, Wistron, Amcor) gain long-term foundational demand for NVIDIA's highest-margin products through 2026 and beyond.